NEXT-GENERATION ULTRA-HIGH-SPEED MICROWAVE

Photonic integrATed circuiTs using advancEd hybRid iNtegration

PATTERN-will-develop-the-world-s-first-Process-and-Assembly-Design-Kits-for-microwave-photonics-at-ultra-high-frequencies

PATTERN will develop the world’s first Process and Assembly Design Kits for microwave photonics at ultra-high frequencies

PATTERN will develop a all-in one Photonics Integrated Circuit platform featuring the world’s first Process and Assembly Design Kits (PDK & ADK) for 100+ GHz microwave photonics, the cointegration of BiCMOS drivers, light source and detectors, optical isolator and acousto-optics modulators.

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demonstrators

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Consortium

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View PIC images from the PATTERN project and PATTERN’s sister project ELENA.

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Integrating RF connectors directly with PICs

Packaging innovation on an LNOI-based high-speed modulator device developed as part of the PATTERN project

The PATTERN
partnership