Integrating RF connectors directly with PICs

High-performance, cost-effective, and volume scalable RF photonics devices require seamless integration of photonics and electronics. So why not integrate RF connectors directly with PICs?

This alternative to RF interposers and wire/ribbon bonds provides a higher level of miniaturization and can minimize losses by shortening signal paths and reducing the number of RF interfaces.

PHIX performed this packaging innovation on an LNOI-based high-speed modulator device developed as part of the PATTERN project. Within this groundbreaking research, PHIX aims to develop novel photonics packaging technologies for future commercialization and industrialization.

Designed by UCL with Luceda Photonics software, the chip was fabricated by CSEM, and packaged by PHIX, perfectly illustrating the collaboration at the core of our project.

*View the original post on PHIX Photonics Assembly LinkedIn page.