Photonic integrATed circuiTs using advancEd hybRid iNtegration

In a nutshell

PATTERN will introduce novel PIC functionalities that currently do not exist

PATTERN is the acronym of the full project title “Next-generation ultra-high-speed microwave Photonic integrATed circuiTs using advancEd hybRid iNtegration”

During its runtime of 4 years, PATTERN will develop the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra-high frequencies (100+ GHz) as well as new methods of heterogeneous integration of III-V gain materials (e.g. InP) and BiCMOS drivers with electro-optic and nonlinear platforms such as lithium niobate on insulator (LNOI).


Key facts


PATTERN is funded by the EU Research and Innovation Programme Horizon Europe under Grant Agreement No 101070506.

In addition, PATTERN includes partners from the UK, Switzerland and Cyprus, receiving as such funding from UKRI (UK Research and Innovation) and SERI (Swiss State Secretariat for Education, Research and Innovation).


PATTERN aims to

  • develop the world’s first PDK and ADK for microwave photonics at ultra‐high frequencies above 100 GHz;
  • introduce novel PIC functionalities that currently do not exist, such as magneto‐optic isolators and acousto-optic modulators (AOMs);
  • develop new methods for photonic and electronic co-integration;
  • cover all PIC foundry process steps, from design and simulation to device fabrication, packaging, and testing;
  • showcase the advanced functionalities of the developed PIC prototypes through several demonstrators.

The PATTERN consortium consists of renowned ten European research institutions, SMEs and industrial players.

It unites unique expertise for delivering disruptive high-performing PIC solutions that will benefit the entire photonics sector.

Project datasheet


PATTERN’s vision of an all-in-one chip

PATTERN will integrate all major photonic functionalities on one single hybrid PIC, To this end, PATTERN will:



novel advanced PIC building blocks such as acousto-optic modulators (AOMs) by combining surface acoustic waveguides (SAWs) and waveguides as well as magneto-optic isolators through hybrid integration of yttrium iron garnet (YIG) and LNOI



a wafer-scale solution for heterogeneous integration of indium phosphite (InP) gain chips and photodetectors on top of an LNOI platform by flip-chip bonding and micro-transfer print



all processing steps and expertise for microwave photonics at ultra-high speeds (above 100 GHz), from PDK components such as LNOI modulators and InP detectors to assembly and packaging as well as BiCMOS drivers and design software for microwave



unrivalled new PIC functionalities, components and subsystems such as fast tuneable lasers for a vast range of applications, from quantum computing and quantum communication to ultra-high-speed telecom, optical computing, sensing and metrology



the capabilities of the new ultra high-speed components and heterogeneous integration through six major prototypes for different end-user applications in the fields of quantum computing and sensing to space communication systems and low-noise microwave generation (OEOs and OPLLs)