NEXT-GENERATION ULTRA-HIGH-SPEED MICROWAVE
Photonic integrATed circuiTs using advancEd hybRid iNtegration
Technology
Comparision between different III-V on wafer-scale heterogeneous integration strategies
Flip-chip
Heterogeneous bonding
Micro-transfer printing
| Technology | Integration density | CMOS compatibility | Efficiency of III-V material use | Alignment accuracy | Versatility in (co-)integration of non-inherent functionalities | Throughput | cost | Maturity |
| Flip-chip | Low | Back-end compatible | Medium | Medium | Medium | Low | High | Mature |
| Heterogeneous bonding | Medium | Back-end compatible | Medium | High | Low | High | Medium | Mature |
| Micro-transfer printing | High | Back-end compatible | High | Medium | High | High | Low | R&D |
G. Roelkens et al., “Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits,” in IEEE Journal of Selected Topics in Quantum Electronics