NEXT-GENERATION ULTRA-HIGH-SPEED MICROWAVE

Photonic integrATed circuiTs using advancEd hybRid iNtegration

Technology

Comparision between different III-V on wafer-scale heterogeneous integration strategies

Flip-chip

Flip-chip

Heterogeneous bonding

Heterogeneous-bonding

Micro-transfer printing

Micro-transfer-printing
Technology Integration density CMOS compatibility Efficiency of III-V material use Alignment accuracy Versatility in (co-)integration of non-inherent functionalities Throughput cost Maturity
Flip-chip Low Back-end compatible Medium Medium Medium Low High Mature
Heterogeneous bonding Medium Back-end compatible Medium High Low High Medium Mature
Micro-transfer printing High Back-end compatible High Medium High High Low R&D

G. Roelkens et al., “Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits,” in IEEE Journal of Selected Topics in Quantum Electronics