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NEXT-GENERATION ULTRA-HIGH-SPEED MICROWAVE
Photonic integrATed circuiTs using advancEd hybRid iNtegration
We’re thrilled to share the remarkable progress of our PATTERN project. We’re steadily approaching our milestones, moving closer to seamless material platform integration and prototyping.
The PATTERN project will enable the heterogeneous combination of both active and passive photonics components together with high-speed electronics on a single LNOI integrated circuit.
One of the goals of the PATTERN projet is to achieve on-chip optical isolation. In this context, the close collaboration between the CNRS-Thales Joint Physics Laboratory …
Many thanks to all PATTERN partners for the terrific touch base (official lingo: consortium meeting) in London! It was great to meet in person, …
PATTERN is pleased to announce that, following a successful application, the University of Cyprus (UCY) will soon join the PATTERN consortium as a “hop-on” partner.
Must read: This news post by the European Commission: “Did you know that more than 1 trillion computer chips were produced worldwide in 2020? That’s around 130 chips for every person on earth”…
On 15 and 16 September, the PATTERN consortium gathered for the official project kick-off at CSEM in Neuchâtel/Switzerland.
We are so excited about the launch of the Horizon Europe project PATTERN!