NEXT-GENERATION ULTRA-HIGH-SPEED MICROWAVE
Photonic integrATed circuiTs using advancEd hybRid iNtegration
General assembly meeting in Gent
We’re thrilled to share the remarkable progress of our PATTERN project. We’re steadily approaching our milestones, moving closer to seamless material platform integration and prototyping.
PATTERN is now sprinting forward, rapidly merging Photonic Integrated Circuits (PICs) with Electronics to meet emerging needs in diverse fields.
Our success thrives on the outstanding synergy among our partners.
A big thanks to our wonderful hosts at UGent and IMEC.